SPEAKERS

 

Prof. Ehrenfried Zschech
Brandenburg University of Technology Cottbus-Senftenberg, Germany

Title: High-resolution X-ray Imaging for Industrial Process Monitoring and Quality Control
Abstract: High-resolution X-ray imaging provides nondestructive characterization capabilities on opaque objects, observing features with sizes across a range of length scales, down to several 10 nanometers using lens-based transmission X-ray microscopy (TXM). X-ray computed tomography (XCT), characterized by a sample thickness/resolution value of ~ 103 , and subsequent 3D data reconstruction, is an efficient approach to study the 3D morphology of natural and engineered hierarchically structured systems and materials. Because of the ability of micro-XCT and nano-XCT to reveal structural characteristics, to determine deviations from a well-defined standard, or to observe kinetic processes, they are potential imaging techniques for micro- and nano-structured objects, but also for industrial process monitoring and quality control [1]. In this talk, typical applications of high-resolution XCT are categorized into 3 groups: 1) Creation of 3D digital images of the complete interior structure of an opaque object, e.g., a natural object or an engineered composite or skeleton material (typically for fundamental research), 2) Monitoring industrial processes and defect inspection (e.g., in the semiconductor industry), and 3) Observing kinetic processes in objects, both in materials synthesis and in materials ageing, important for industrial quality control and reliability engineering. These different categories of applications have different requirements for the accuracy of the 3D reconstruction and for the time-to-data [2]. While the highest possible resolution is requested for group 1, data acquisition and data analysis time are essential for group 2. To get highresolution 3D information of the complete interior structure of an opaque object using lens-based laboratory nano-XCT requires a thorough data analysis, e.g., the application of deep convolutional neural networks, for denoising and mitigation of artefacts. On the micro- and nanoscale, thermomechanical instability of tool components and object motion, center of rotation misalignment, and inaccuracy in the detector position require computational efforts [3]. Advanced 3D reconstruction methodologies consider these unavoidable effects during the image acquisition [4].
The rapid evolution of advanced semiconductor technologies, including technologies for heterogeneous 3D integration of ICs and chiplet architectures, presents significant challenges for metrology, defect inspection, and physical failure analysis (PFA). The application of nano-XCT as a highly reliable inspection method requires a balance between throughput and fault detection (i.e., measurement and reconstruction accuracy) [5]. Ways for a drastic acquisition speed increase are high-brilliance laboratory X-ray sources, the application of AI algorithms for new image acquisition protocols, and high-speed data processing. An outlook for a seamless workflow for advanced package FA and defect inspection, that combines acoustic and X-ray techniques to auto-detect and auto-classify defects, with the goal to improve throughput and defect detectability, will be presented [6]. Finally, kinetic studies, e.g., of reliability-limiting degradation processes in microchips, provide the opportunity to establish appropriate risk mitigation strategies to avoid catastrophic failure. The nano-XCT imaging of the microcrack evolution points out possible directions to ensure the requested mechanical robustness of microchips and of heterogeneously integrated chiplets, applying advanced packaging technologies [7].
[1] E Zschech, Handbook of Nondestructive Evaluation 4.0, 1377 (2025)
[2] M. V. Chukalina, ITiVS 2, 3 (2025)
[3] E. Topal et al., BMC Mater. 2, 1 (2020), Sci. Rep. 10, 1 (2020)
[4] K. Bulatov et al., Nanomaterials 11, 2524 (2021)
[5] EDFAS Electronic Device Failure Analysis Technology Roadmap, ASM International (2023)
[6] E. Zschech et al., ISMP IRSP Busan, Korea (2024)
[7] K. Kutukova et al., Materials & Design 221, 110946 (2022)

Biodata: Ehrenfried Zschech is a consultant with hands-on experience in the fields of advanced materials, nanotechnology, and microelectronics, as well as process control and quality assessment. He holds honorary professorships in Nanomaterials at Brandenburg University of Technology Cottbus-Senftenberg and in Nanoanalysis at Dresden University of Technology, and he is a Guest Chair Professor at Southeast University, Nanjing, China. His activities include high-resolution Xray imaging and the development of customized solutions for a broad range of applications, including package failure analysis, metrology, and inspection in microelectronics. Ehrenfried Zschech received his Dr. rer. nat. degree from Dresden University of Technology. He held several management positions at Airbus, Advanced Micro Devices, Fraunhofer, and the start-up deepXscan. Ehrenfried Zschech is a Member of the European Academy of Science (EurASc) and a Member of the German National Academy of Science and Engineering (ACATECH). In 2019, he was awarded the FEMS European Materials Gold Medal, in 2023 the DGM Pioneer Award, and with the Roland Mitsche Prize.

coming more soon......